When should supplementary bonding be implemented?

Supplementary bonding is implemented specifically to reduce the risk of touch voltage in situations where there may be a fault condition. It serves to create a low-impedance path for fault currents, ensuring that any potentially hazardous voltages that could arise during a fault are mitigated. This practice is particularly critical in areas where there is a heightened risk of electric shock, such as in locations with water, metal structures, or unstable grounding conditions.

While it may seem beneficial to apply supplementary bonding in all installations or certain specific types like commercial properties, the requirement is not universal. Comprehensive regulations and standards dictate when supplementary bonding should be used, with a primary focus on enhancing safety where risks are identified. Therefore, the strategy should be targeted towards those environments that specifically warrant additional bonding due to the risk of touch voltage, aligning with best practices established in electrical safety standards.